Citations
ABNT
DAS, M. et al. Inter-Electronic Interaction between Ni and Mo in Electrodeposited Ni-Mo-P on 3D Copper Foam Enables Hydrogen Evolution Reaction at Low Overpotential. Inorganic chemistry, [s. l.], v. 61, n. 45, p. 18253–18259, 2022. DOI 10.1021/acs.inorgchem.2c03074. Disponível em: https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=cmedm&AN=36310353&authtype=uid&user=rmabrowserextension&password=Br0wserExtension789! Acesso em: 30 set. 2023.
AMA 11th Edition
Das M, Khan ZB, Biswas A, Dey RS. Inter-Electronic Interaction between Ni and Mo in Electrodeposited Ni-Mo-P on 3D Copper Foam Enables Hydrogen Evolution Reaction at Low Overpotential. Inorganic chemistry. 2022;61(45):18253-18259. doi:10.1021/acs.inorgchem.2c03074
APA 7th Edition
Das, M., Khan, Z. B., Biswas, A., & Dey, R. S. (2022). Inter-Electronic Interaction between Ni and Mo in Electrodeposited Ni-Mo-P on 3D Copper Foam Enables Hydrogen Evolution Reaction at Low Overpotential. Inorganic Chemistry, 61(45), 18253–18259. https://doi.org/10.1021/acs.inorgchem.2c03074
Chicago 17th Edition
Das, Manisha, Zubair Bashir Khan, Ashmita Biswas, and Ramendra Sundar Dey. 2022. “Inter-Electronic Interaction between Ni and Mo in Electrodeposited Ni-Mo-P on 3D Copper Foam Enables Hydrogen Evolution Reaction at Low Overpotential.” Inorganic Chemistry 61 (45): 18253–59. doi:10.1021/acs.inorgchem.2c03074.
Harvard
Das, M. et al. (2022) ‘Inter-Electronic Interaction between Ni and Mo in Electrodeposited Ni-Mo-P on 3D Copper Foam Enables Hydrogen Evolution Reaction at Low Overpotential’, Inorganic chemistry, 61(45), pp. 18253–18259. doi:10.1021/acs.inorgchem.2c03074.
Harvard: Australian
Das, M, Khan, ZB, Biswas, A & Dey, RS 2022, ‘Inter-Electronic Interaction between Ni and Mo in Electrodeposited Ni-Mo-P on 3D Copper Foam Enables Hydrogen Evolution Reaction at Low Overpotential’, Inorganic chemistry, vol. 61, no. 45, pp. 18253–18259, viewed 30 September 2023, .
MLA 9th Edition
Das, Manisha, et al. “Inter-Electronic Interaction between Ni and Mo in Electrodeposited Ni-Mo-P on 3D Copper Foam Enables Hydrogen Evolution Reaction at Low Overpotential.” Inorganic Chemistry, vol. 61, no. 45, Nov. 2022, pp. 18253–59. EBSCOhost, https://doi.org/10.1021/acs.inorgchem.2c03074.
Chicago 17th Edition
Das, Manisha, Zubair Bashir Khan, Ashmita Biswas, and Ramendra Sundar Dey. “Inter-Electronic Interaction between Ni and Mo in Electrodeposited Ni-Mo-P on 3D Copper Foam Enables Hydrogen Evolution Reaction at Low Overpotential.” Inorganic Chemistry 61, no. 45 (November 14, 2022): 18253–59. doi:10.1021/acs.inorgchem.2c03074.
Vancouver/ICMJE
Das M, Khan ZB, Biswas A, Dey RS. Inter-Electronic Interaction between Ni and Mo in Electrodeposited Ni-Mo-P on 3D Copper Foam Enables Hydrogen Evolution Reaction at Low Overpotential. Inorganic chemistry [Internet]. 2022 Nov 14 [cited 2023 Sep 30];61(45):18253–9. Available from: https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=cmedm&AN=36310353&authtype=uid&user=rmabrowserextension&password=Br0wserExtension789!