Citations
ABNT
DAS, M. et al. Inter-Electronic Interaction between Ni and Mo in Electrodeposited Ni–Mo–P on 3D Copper Foam Enables Hydrogen Evolution Reaction at Low Overpotential. Inorganic Chemistry, [s. l.], v. 61, n. 45, p. 18253–18259, 2022. DOI 10.1021/acs.inorgchem.2c03074. Disponível em: https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=edo&AN=160258399&authtype=uid&user=rmabrowserextension&password=Br0wserExtension789! Acesso em: 1 abr. 2023.
AMA 11th Edition
Das M, Khan ZB, Biswas A, Dey RS. Inter-Electronic Interaction between Ni and Mo in Electrodeposited Ni–Mo–P on 3D Copper Foam Enables Hydrogen Evolution Reaction at Low Overpotential. Inorganic Chemistry. 2022;61(45):18253-18259. doi:10.1021/acs.inorgchem.2c03074
APA 7th Edition
Das, M., Khan, Z. B., Biswas, A., & Dey, R. S. (2022). Inter-Electronic Interaction between Ni and Mo in Electrodeposited Ni–Mo–P on 3D Copper Foam Enables Hydrogen Evolution Reaction at Low Overpotential. Inorganic Chemistry, 61(45), 18253–18259. https://doi.org/10.1021/acs.inorgchem.2c03074
Chicago 17th Edition
Das, Manisha, Zubair Bashir Khan, Ashmita Biswas, and Ramendra Sundar Dey. 2022. “Inter-Electronic Interaction between Ni and Mo in Electrodeposited Ni–Mo–P on 3D Copper Foam Enables Hydrogen Evolution Reaction at Low Overpotential.” Inorganic Chemistry 61 (45): 18253–59. doi:10.1021/acs.inorgchem.2c03074.
Harvard
Das, M. et al. (2022) ‘Inter-Electronic Interaction between Ni and Mo in Electrodeposited Ni–Mo–P on 3D Copper Foam Enables Hydrogen Evolution Reaction at Low Overpotential’, Inorganic Chemistry, 61(45), pp. 18253–18259. doi:10.1021/acs.inorgchem.2c03074.
Harvard: Australian
Das, M, Khan, ZB, Biswas, A & Dey, RS 2022, ‘Inter-Electronic Interaction between Ni and Mo in Electrodeposited Ni–Mo–P on 3D Copper Foam Enables Hydrogen Evolution Reaction at Low Overpotential’, Inorganic Chemistry, vol. 61, no. 45, pp. 18253–18259, viewed 1 April 2023, .
MLA 9th Edition
Das, Manisha, et al. “Inter-Electronic Interaction between Ni and Mo in Electrodeposited Ni–Mo–P on 3D Copper Foam Enables Hydrogen Evolution Reaction at Low Overpotential.” Inorganic Chemistry, vol. 61, no. 45, Nov. 2022, pp. 18253–59. EBSCOhost, https://doi.org/10.1021/acs.inorgchem.2c03074.
Chicago 17th Edition
Das, Manisha, Zubair Bashir Khan, Ashmita Biswas, and Ramendra Sundar Dey. “Inter-Electronic Interaction between Ni and Mo in Electrodeposited Ni–Mo–P on 3D Copper Foam Enables Hydrogen Evolution Reaction at Low Overpotential.” Inorganic Chemistry 61, no. 45 (November 14, 2022): 18253–59. doi:10.1021/acs.inorgchem.2c03074.
Vancouver/ICMJE
Das M, Khan ZB, Biswas A, Dey RS. Inter-Electronic Interaction between Ni and Mo in Electrodeposited Ni–Mo–P on 3D Copper Foam Enables Hydrogen Evolution Reaction at Low Overpotential. Inorganic Chemistry [Internet]. 2022 Nov 14 [cited 2023 Apr 1];61(45):18253–9. Available from: https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=edo&AN=160258399&authtype=uid&user=rmabrowserextension&password=Br0wserExtension789!