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Advanced Search Results For "COPPER-tin alloys"

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 "COPPER-tin alloys"
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Investigation of Cu-Sn-Cu transient liquid phase bonding for microsystems packaging.

Publication Type: Academic Journal

Source(s): Materials & Manufacturing Processes. 2023, Vol. 38 Issue 3, p284-294. 11p.

Abstract: Fabrication, characterization, and thermomechanical reliability of electroplated Cu-Sn-Cu-based transient liquid phase (TLP) bonding required in microsystems packaging are reported. Die-level bonding was achieved using 8-μm-thick electroplated copper p...

Effect of Cu, Ni, Ag addition on creeping properties of Sn5Sb-0.5Cu-0.1Ni-0.5Ag for high temperature packaging.

Publication Type: Academic Journal

Source(s): Soldering & Surface Mount Technology. 2022, Vol. 34 Issue 5, p287-291. 5p.

Abstract: Purpose: This paper aims to investigate the effect of the Cu, Ni and Ag addition in Sn5Sb-based alloy on the mechanical properties and its mechanism. Design/methodology/approach: The micro-indentation, creeping test of the Cu/Sn5Sb–0.5Cu–0.1Ni–0.5Ag/Cu...

Microstructure, Mechanical, and Nanotribological Properties of Ni, Ni-TiN, and Ni90Cu10-TiN Films Processed by Reactive Magnetron Cosputtering.

Publication Type: Academic Journal

Source(s): Advances in Materials Science & Engineering. 2/23/2022, p1-8. 8p.

Abstract: In this study, nanocrystalline Ni, Ni-TiN, and Ni90Cu10-TiN coatings were processed using reactive magnetron cosputtering of Ni, Cu, and Ti targets under Ar and N2 gas environment. The phase evolution and structure of coatings were analyzed by the X-ra...


Publication Type: Academic Journal

Source(s): Acta Archaeologica Lodziensia. 2022, Issue 68, p39-48. 10p.

Abstract: W pracy zaprezentowano znaleziska monet rzymskich z terenu Podola. Oceniono je, jako element wpływów rzymskich na tereny kultury czerniachowskiej, I-III ww. n.e [ABSTRACT FROM AUTHOR]

Effects of Sn and Gd on the (β1 + β3) stability field in the Cu-11%Al-10%Mn alloy.

Publication Type: Academic Journal

Source(s): Journal of Thermal Analysis & Calorimetry. Mar2023, Vol. 148 Issue 6, p2357-2366. 10p.

Abstract: Effects of Sn and Gd additions on the (β1 + β3) field in the Cu-11%Al-10%Mn alloy were studied by in situ X-ray diffraction, differential scanning calorimetry, non-isothermal kinetics, and magnetization measurements as a function of the temperature. Th...

Effect of Cu-Sn Addition on Corrosion Property of Pressureless Sintered Fe-Cu-Co Substrate Alloys.

Publication Type: Academic Journal

Source(s): Materials (1996-1944). Jan2023, Vol. 16 Issue 2, p728. 12p.

Abstract: Fe-Cu-Co prealloyed powder is used for bonding metal of diamond tools. In order to obtain diamond tools with good mechanical properties by pressureless sintering, it is necessary to add Cu-Sn sintering aids. The substrate also has high corrosion resist...

Retarding microstructural evolution of multiple-elemental SnAgCu solder joints during thermal cycling by strengthening Sn matrix.

Publication Type: Academic Journal

Source(s): Journal of Materials Science. Mar2023, Vol. 58 Issue 9, p4199-4212. 14p. 2 Color Photographs, 3 Diagrams, 3 Charts, 1 Graph, 5 Maps.

Abstract: In this paper, we proposed a method of strengthening Sn-based solder to retard the microstructural evolution during thermal cycling and thus to improve the thermal fatigue life of Sn-based solder joint. We fabricated a multiple-elemental Sn-based solde...

Interfacial Reaction and Electromigration Failure of Cu Pillar/Ni/Sn-Ag/Cu Microbumps under Bidirectional Current Stressing.

Publication Type: Academic Journal

Source(s): Materials (1996-1944). Feb2023, Vol. 16 Issue 3, p1134. 10p.

Abstract: The electromigration behavior of microbumps is inevitably altered under bidirectional currents. Herein, based on a designed test system, the effect of current direction and time proportion of forward current is investigated on Cu Pillar/Ni/Sn-1.8 Ag/Cu...

Effect of Sn Addition on Microstructure, Aging Properties and Softening Resistance of Cu-Cr Alloy.

Publication Type: Academic Journal

Source(s): Materials (1996-1944). Dec2022, Vol. 15 Issue 23, p8441. 9p.

Abstract: The relationship between microstructure evolution and properties of a Cu-Cr-Sn alloy during aging and high-temperature softening was investigated in detail in the present work. The results show that the addition of Sn refines obviously the size of the ...

Microstructure and performance of glass fiber metal composite-bonded diamond segment with Cu-Sn-Ti alloy.

Publication Type: Academic Journal

Source(s): Ceramics International. Oct2022, Vol. 48 Issue 20, p30670-30680. 11p.

Abstract: To develop metal-bonded diamond tools without dressing during machining, a novel glass fiber metal composite bonding agent with Cu–Sn–Ti alloy was proposed. The three-point bending strength of the diamond segments and the Vickers microhardness of the s...