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Advanced Search Results For "THERMAL resistance"

1 - 10 of 13,803 results for
 "THERMAL resistance"
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Effect of Surface Modification of Carbon Nanotubes on the Properties of High-Strength and High-Conductivity Copper Matrix Composites.

Publication Type:Academic Journal

Source(s):Mathematical Problems in Engineering. 6/25/2022, p1-10. 10p.

Abstract:The use of carbon nanotubes (CNTs) as the reinforcing phase to prepare copper-based composite materials can improve the strength and high conductivity of copper-based conductors. In order to analyze the effect of surface oxidation modification on the s...

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Electrical and thermal percolation in two-phase materials: A perspective.

Publication Type:Academic Journal

Source(s):Journal of Applied Physics. 6/21/2022, Vol. 131 Issue 23, p1-15. 15p.

Abstract:Electrical percolation in two-phase materials involves a very singular behavior, manifested as a huge change in the electrical conductivity, for a given volume or mass fraction of the phase with higher conductivity. In contrast, in the case of heat tra...

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Interfacial thermal transport between graphene and diamane.

Publication Type:Academic Journal

Source(s):Journal of Chemical Physics. 4/28/2022, Vol. 156 Issue 16, p1-8. 8p.

Abstract:Similar to graphene, diamane is a single layer of diamond that has been investigated in recent years due to its peculiar mechanical, thermal, and electronic properties. Motivated by earlier work that showed an exceptionally high intra-plane thermal con...

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A generalized differential quadrature-based computational model for describing free vibrations behavior of functionally graded circular plates around buckled configuration.

Publication Type:Academic Journal

Source(s):Scientia Iranica. Transaction B, Mechanical Engineering. May/Jun2022, Vol. 29 Issue 3, p1250-1264. 15p.

Abstract:The present study aims to examine the vibrational behavior of buckled Functionally Graded (FG) circular plates under clamped and simply-supported edge conditions. To this end, von Kffarmffan assumptions were taken into account to incorporate geometric ...

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NSGA-II-Based Microchannel Structure Optimization Problem Study.

Publication Type:Academic Journal

Source(s):Scientific Programming. 4/7/2022, p1-7. 7p.

Abstract:A multiobjective genetic algorithm is used to optimize the structure of circular concave cavities and microchannels. The objective functions of thermal resistance and pumping power are constructed by the response plane approximation method according to...

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Modelling method to evaluate the thermo-regulating behaviour of micro-encapsulated PCMs coated fabric.

Publication Type:Academic Journal

Source(s):Industria Textila. 2022, Vol. 73 Issue 1, p3-11. 9p.

Abstract:Materialele cu schimbare de fază micro-încapsulate (MicroPCM) au fost utilizate pe scară largă pentru a spori confortul termic al îmbrăcămintei; pot fi aplicate pe materialul textil prin diferite tehnici, inclusiv prin procesul de acoperire. Materialul...

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Measuring sub-surface spatially varying thermal conductivity of silicon implanted with krypton.

Publication Type:Academic Journal

Source(s):Journal of Applied Physics; 8/21/2022, Vol. 132 Issue 7, p1-12, 12p

Abstract:Copyright of Journal of Applied Physics is the property of American Institute of Physics and its content may not be copied or emailed to multiple sites or posted to a listserv without the copyright holder's express written permission. However, users ma...

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Performance Study of the Thermoelectric Personal Cooler under Different Ambient Temperatures.

Publication Type:Academic Journal

Source(s):International Journal of Heat & Technology. Feb2022, Vol. 40 Issue 1, p53-62. 10p.

Abstract:In this study, a Thermo Electric Cooler (TEC) was manufactured and investigated experimentally. The heat sink, geometry, fin number, fin length, and heat sink dimensions are studied theoretically. The performance of the TEC is studied under three varia...

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Thermal conductivity evaluation of ion irradiated Si3N4 and ZrN ceramics using spatial domain thermoreflectance.

Publication Type:Academic Journal

Source(s):Journal of Applied Physics; 8/21/2022, Vol. 132 Issue 7, p1-9, 9p

Abstract:Copyright of Journal of Applied Physics is the property of American Institute of Physics and its content may not be copied or emailed to multiple sites or posted to a listserv without the copyright holder's express written permission. However, users ma...

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Effects of In Situ Modification of Aluminum Fillers on the Rheological Properties and Thermal Resistance of Gel Thermal Interface Materials.

Publication Type:Academic Journal

Source(s):IEEE Transactions on Components, Packaging & Manufacturing Technology. Aug2022, Vol. 12 Issue 8, p1302-1310. 9p.

Abstract:Thermal interface materials (TIMs) used to fill the gaps between chip and heat sink are one of the most important materials for electronic packaging. Low thermal resistance is the key to achieving high heat dissipation efficiency. However, most studies...

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